ALPHA solder paste
ALPHA® OM-100 SnCX® 07 solder paste is a lead-free, silver-free, no-clean solder paste that provides reliability comparable to SAC systems while further reducing the total cost of ownership (TCO). This solder paste is particularly suitable for product lines with stringent cost control requirements, effectively improving overall assembly profitability. Compared to SAC305-based solder pastes, OM-100 SnCX 07 offers an average improvement of approximately 50% in mechanical strain resistance, significantly extending the lifespan of white goods and smart home electronic components, especially suitable for applications requiring resistance to environmental challenges such as vibration and drop impacts. This solder paste balances superior performance with cost-effectiveness, maximizing overall value without sacrificing reliability.
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ALPHA OM362 solder paste boasts an ultra-low bubble rate. In existing processes, it achieves an average solder bubble rate of less than 10% when soldering BGA, QFN, LGA, and MOSFET grounding components. This improves product soldering reliability.
ALPHA CVP-390SACX0307 effectively reduces usage costs while ensuring soldering quality.
1: ALPHA’s patented alloy formula.
2: Completely halogen-free, offering highly reliable soldering performance.
3: Improved continuous printability.
ALPHA OM340 flux is a completely halogen-free flux with excellent wetting and soldering properties. It is suitable for use with OM340 solder paste. It is a lead-free, zero-halogen solder paste with low voids and colorless, transparent solder residue. It meets automotive pre-installation requirements.
ALPHA OM338PT lead-free, zero-halogen flux offers high-reliability soldering.