Wave soldering Selective soldering Solder nozzles

1.Wave soldering
Wave soldering is a process where the PCBs are passed over a molten wave of solder that attaches the components to the board. The wave soldering machine consists of a conveyor belt, a fluxing station, a preheating station, a soldering station, and a cooling station. Wave soldering is suitable for mass production of simple and low-cost PCBs, as it is fast, reliable, and efficient. However, wave soldering also has some limitations, such as high energy consumption, difficulty in soldering fine-pitch and surface-mount components, and potential thermal damage to the PCBs and components.

2.Selective soldering
Selective soldering is a process where only the selected areas of the PCBs are soldered, using a programmable machine that controls the solder nozzle movement and flow. The selective soldering machine consists of a conveyor belt, a fluxing station, a preheating station, a soldering station, and a cooling station. Selective soldering is suitable for complex and high-quality PCBs, as it offers more flexibility, precision, and control over the soldering process. However, selective soldering also has some challenges, such as high initial cost, longer cycle time, and more maintenance requirements.

3.Solder nozzles
Solder nozzles are the parts of the selective soldering machine that deliver the molten solder to the desired locations on the PCBs. The design of the solder nozzles depends on the type and size of the components to be soldered, the pitch and clearance of the PCBs, and the quality and reliability of the solder joints. Some common types of solder nozzles are mini-wave, jet-wave, multi-jet, and micro-jet. The solder nozzles should be designed to minimize solder bridging, skipping, and splashing, and to ensure consistent solder flow and temperature.